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Brand Name : ABIS
Model Number : ABIS 00011
Certification : UL
Place of Origin : SHEN ZHEN CHINA
MOQ : 1
Price : 0.1-0.8
Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability : 5000000
Delivery Time : 5-8 working day
Packaging Details : vacuum package
Board thickness : 1.6mm,0.2-7.0mm(≤0.2mm needs review)
Base material : FR-4,Aluminum base
Surface finishing : HASL,OSP,ENIG
Min. line spacing : 0.003",0.15mm
Min. line width : 3mil,0.15mm,0.05 mm
Copper thickness : 1oz,1/2OZ 1OZ 2OZ 3OZ
Min. hole size : 0.25mm,0.1mm
Application : Consumer Electronics,Electronics Device,Electrice Vehicle
Material : FR4 CEM1 CEM3 Hight TG
Product name : Pcb Board Assembly,Printed Circuit Board
Solder mask color : Green Black Red,Blue.green.red.black.white.etc
Solder mask : Green
Type : Electronic Board
Item : Custom Circuit Board
Usage : OEM Electronics
Name : PCB Board Production
Number of layers : 1-40 ( ≥30 layers needs review )
ABIS CIRCUITS CO., LTD
Created in 2006,as a long history China based PCB supplier, ABIS manufactures different kinds of printed circuit boards, including MCPCB,CEM-1,CEM-3,and FR4,FR-4 high Tg, Rogers, Teflon, Arlon ets special material.
ABIS has set up two PCB factories in China: one for MCPCB producing, quick turn and small volumn making, and another for mass production. Currently, ABIS modern plants occupy total 10000 s.q.m facility, with more than 1100 stable and experienced workers. Professionalism and continuous optimization of manufacturing processes have positioned ABIS as a reliable and favorite partner for global companies.
Items |
Single/Double-sidedBoard/MutilayerBoard/FPC(1-24Layer) | ||
BaseMaterials |
FR-4(HighTG150*-170^),FR1.Aluminum,CEM-3,BT,94V0 | ||
Finishcopperthickness |
Outer6OZ,nner40Z | ||
Surfacefinish |
ENIG,ImAg.ImSn,0SP,HASL,Platinggold | ||
FinishedBoardSize |
MaxDouble-sidedBoard |
640mmX1100mm | |
MaxMutilayerBoard |
640mmX1100mm | ||
FinishedBoardHoleSize(PTHHole) |
MinFinishedBoardHoleSize |
0.15mm | |
ConductorWidthandSpacing |
MinConductorWidh |
0.01mm | |
MinConductorSpacing |
0.01mm | ||
ThicknessofPlatingandCoatingLayer |
PTHwallCopperThickness |
>0.02mm | |
TinSolderThickness(HotAlrLeveling) |
>0.02mm | ||
Nickl/GoldThickness |
Forcustomerspecialneed | ||
NicklPlatingLayer |
>2um | ||
GoldPlatingLayer |
>0.3um | ||
BareBoardTest |
SinglesideTest |
MaxTestPoint |
20480 |
MaxBoardTestSize |
400mmx300mm | ||
DoubleSldeTest |
MaxTestPoint |
40960(GeneralUse) | |
4096(SpecialUse) | |||
MaxBoardTestSize |
406mmx325mm | ||
320mmx400mm | |||
MinTestpitchofSMT |
0.5mm | ||
TestVoltage |
10-250V | ||
MechanicalProcess |
Chamfer |
20*,30*,45*,60* | |
AngleTolerance |
| ||
DeepnessTolerance |
士0.20mm | ||
V.CutAngle |
20",30*,45* | ||
BoardThickness |
0.1-3.2mm | ||
ResiduesThickness |
:0.025mm | ||
CellParapositionPrecision |
士0.025mm | ||
ToleranceofOut-shapeProcess |
土0.1mm | ||
BoardWarp |
MaxValue |
0.7% | |
Optical Plotting |
MaxPlottingArea |
66mmX558.8mm |
Q/TLead Time
Category |
Quickest Lead Time |
Normal Lead Time |
Double sides |
24hrs |
120hrs |
4 layers |
48hrs |
172hrs |
6 layers |
z2hrs |
192hrs |
8 layers |
96hrs |
212hrs
268hrs |
10 layers |
120hrs | |
12 layers |
120hrs |
280hrs |
14 layers |
144hrs |
292hrs |
16-20 layers |
Depends on the specific requirements | |
Above 20 layers |
Depends on the specific requirements |
On time delivery rate is more than 95%
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3OZ Fr4 Multilayer Print Circuit Board 24 layer FR4 CEM1 Rigid PCB Board Images |