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Abis Circuits Co., Ltd.
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FR4 TG170 Multi Layer PCB Black Ink HDI PCB 4 Layer 6 Layer OEM ODM

Abis Circuits Co., Ltd.
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FR4 TG170 Multi Layer PCB Black Ink HDI PCB 4 Layer 6 Layer OEM ODM

Brand Name : ABIS

Model Number : FR-R003

Certification : ISO14001, ISO9001, UL

Place of Origin : Made in China

MOQ : 1

Price : Customized

Payment Terms : T/T, Western Union, Paypal , D/A, D/P

Supply Ability : 60,000sqm per month

Delivery Time : 7-14 working days

Packaging Details : Vacuum package, carton package

PCB Base Material : FR4 TG170

Circuit Board Copper : 1oz

Layer : 1,2,4,6,8

PCB Surface finishing : ENIG

Solder mask : Black

Silk Screen : White

Size : 80mm*60mm

Profile : rout

Min. line width : 3mil/3mil

Min. hole size : 0.15mm

Application : automotive electronics components, Computer

Testing : 100%E-Testing, PCB Flying test, AOI, X-RAY, PCBA Funtion test/Electronic test

Approved : UL

Base Materal : Copper

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Multi layer PCB Black ink HDI PCB 4 layer 6 layer OEM ODM Quick Turn

Electronic Board, Rogers PCB, Rogers, High Performance, RF Identification Tags,Multi-Layer

Abis Circuits Co. Ltd is a great PCB manufacturer that was established in 2006 and is based in Shenzhen (China’s “Silicon Valley”).

What is the Application of PCB?

With the shift of industry from analog to digital. The mass production of PCB has been stimulated. From the radio, TV, and tape recorder, to the walkman, calculators, computers, laptops, and SPC exchanges. With the high development of electronic products, it's hard to do the same way that used 3C to define the PCB,

FR4 TG170 Multi Layer PCB Black Ink HDI PCB 4 Layer 6 Layer OEM ODM

What are the application fields of printed Circuit boards?

Mobile phones, microwaves, Consumer Electronics, communications, network base stations, hybrid integrated circuits, and home fans.

What certificates and capacity does ABIS have?

We have ISO14001, ISO9001, UL, and so on.

Raw material FR-4, High TG FR-4, PTFE, Aluminum Base, Cu base. Rogers, etc
Board Thickness 0.20mm--8.00mm
Layer 1 Layer-20 Layer
Insulation Layer Thickness 0.075mm--5.00mm
Min.hole size 0.1mm (drilling hole)
Max. Board size 200mm*600mm
Out Layer Copper Thickness 18um--350um
Inner Layer Copper Thickness 17um--175um
NPTH Hole Tolerance +/- 0.075mm
PTH hole Tolerance +/-0.05mm
Outline tolerance +/-0.13mm
Surface finished HASL, ENIG, Chem. Tin, Flash Gold, OSP, Gold finger
Solder Mask Type LPI
Others RFQ.

What is your Lead Time?

Category

Q/T Lead time

Standard Lead Time

Mass Production

2 Layers

24hrs

3-4 working days

8-15 working days

4 Layers

48hrs

3-5 working days

10-15 working days

6 Layers

72hrs

3-6 working days

10-15 working days

8 Layers

96hrs

3-7 working days

14-18 working days

10 Layers

120hrs

3-8 working days

14-18 working days

12 Layers

120hrs

3-9 working days

20-26 working days

14 Layers

144hrs

3-10 working days

20-26 working days

16-20 Layers

Depends on the specific requirements

20+ Layers

Depends on the specific requirements

We are not only good at product quality but also FINANCIALLY FIT because we pay attention to goodwill since 2006 in this opening city-Shenzhen, China.


Product Tags:

FR4 TG170 Multi layer PCB

      

Black HDI Multi layer PCB

      

FR4 TG170 PCB

      
Quality FR4 TG170 Multi Layer PCB Black Ink HDI PCB 4 Layer 6 Layer OEM ODM for sale

FR4 TG170 Multi Layer PCB Black Ink HDI PCB 4 Layer 6 Layer OEM ODM Images

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