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Brand Name : ABIS
Model Number : PCB-HDI
Certification : ISO14001, ISO9001, UL, cUL, TS16949
Place of Origin : Made in China
MOQ : 1
Price : Customized
Payment Terms : T/T, Western Union, paypal ect.
Supply Ability : 60,000sqm per month
Delivery Time : 7-15 working days
Packaging Details : Vacuum package
Base material : FR-4 TG170
Min. line spacing : 3mil
Board thickness : 0.2-8.0mm
Min. line width : 3mil
Surface finishing : Immersion Gold,HASL,ENIG,Gold plating,HASL Lead Free,OSP
Number of layers : 1-20 Layers/Up to 20 Layers
Solder mask : Green. Red. Blue. White. Black.Yellow
Product name : Printed Circuit Board,fr4 pcb manufacturer,PCB board,HDI multilayer circuit board pcb,Custom HASL/Immersion gold double side pcb circuit 94vo pcb board
Silkscreen : White/Custom
Service : Customize,One-stop,OEM Services Provided,PCB/SMT/DIP/Component purchase,OEM one-stop service
Testing service : 100% Electrical Test,Fly-probe,Function Testing,100% E-testing,Flying Probe Testing
Other service : PCB Design,Components purchasing and assembly
Pcb test : Flying probe and AOI (Default)/Fixture Test,100% Testing)
Application : Electronics Device,Consumer Electronics,Communications,and so on,Universal
Standard : IPC-A-610 E Class II-III,IPC 6021 Class 2,TDR testing,ISO 9001,Class 3
2 Oz High Density HDI PCB Board Programming Via In Pad HDI Circuit Boards
Key HDI PCB Benefits
The evolution of PCB HDI technology has given engineers greater design freedom and flexibility than ever before. Designers using HDI high density interconnect methods now can place more components on both sides of the raw PCB if desired. In essence, an HDI PCB gives designers more space to work with, while allowing them to place smaller components even closer together. This means that a high-density interconnect PCB ultimately results in faster signal transmission along with enhanced signal quality.
HDI PCB is widely used to reduce the weight and overall dimensions of products, as well as to enhance the electrical performance of the device. The high-density PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras and 4G network communications. The HDI PCB is also prominently featured in medical devices, as well as various electronic aircraft parts and components. The possibilities for high-density interconnect PCB technology seem almost limitless.
Company Profile
Abis Circuits Co., Ltd is a professional PCB manufacturer which was established on Oct, 2006 and focus on single side, double side, Multilayer and HDI pcb mass production.
Briefly introduce our strengths:
1. A professional PCB manufacturer which was established on Oct, 2006
2. Focusing on double side, Multilayer and HDI pcb mass production
3. Two factories, one for small and middle volume orders, another for big volume and HDI
Quotation from ABIS
To ensure an accurate quote, be sure to include the following information for your project:
Your custom quote will be delivered in just 2-24 hours, depending on the design complexity.
Product Description
Item | Production Capacity |
Layer Counts | 1-20 layers |
Material | FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. |
Board thickness | 0.20mm-8.00mm |
Maximum Size | 600mmX1200mm |
Board Outline Tolerance | +0.10mm |
Thickness Tolerance(t≥0.8mm) | ±8% |
Thickness Tolerance(t<0.8mm) | ±10% |
Insulation Layer Thickness | 0.075mm--5.00mm |
Minimum Line | 0.075mm |
Minimum Space | 0.075mm |
Out Layer Copper Thickness | 18um--350um |
Inner Layer Copper Thickness | 17um--175um |
Drilling Hole(Mechanical) | 0.15mm--6.35mm |
Finish Hole(Mechanical) | 0.10mm-6.30mm |
Diameter Tolerance(Mechanical) | 0.05mm |
Registration(Mechanical) | 0.075mm |
Aspect Ratio | 16:1 |
Solder Mask Type | LPI |
SMT Mini.Solder Mask Width | 0.075mm |
Mini. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
Impedance control Tolerance | ±10% |
Surface finish/treatment | HASL,ENIG,Chem,Tin,Flash Gold, OSP, Gold Finger |
PCB Capacity
High precision prototype | PCB bulk production | ||
Max Layers | 1-28 layers | 1-14 layers | |
MIN Line width(mil) | 3mil | 3mil | |
MIN Line space(mil) | 3mil | 3mil | |
Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
Board thickness≤2.5mm | 0.2mm | 0.3mm | |
Board thickness>2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
Board thickness | MAX | 8mm | 7mm |
MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
MAX Board size | 610*1200mm | 610*1200mm | |
Max copper thickness | 0.5-6oz | 0.5-6oz | |
Immersion Gold/ Gold Plated Thickness | Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated:50—500u” | ||
Hole copper thick | 25um 1mil | 25um 1mil | |
Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
Outline Tolerance | ≤100mm:+/-0.1mm 100<≤300mm:+/-0.15mm >300mm:+/-0.2mm | ≤100mm:+/-0.13mm 100<≤300mm:+/-0.15mm >300mm:+/-0.2mm | |
Impedance | ±10% | ±10% | |
MIN Solder mask bridge | 0.08mm | 0.10mm | |
Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm |
Lead Time
Category | Quickest Lead Time | Normal Lead Time | |
Double sideds | 24hrs | 120hrs | |
4 Layers | 48hrs | 172hrs | |
6 Layers | 72hrs | 192hrs | |
8 Layers | 96hrs | 212hrs | |
10 Layers | 120hrs | 268hrs | |
12 Layers | 120hrs | 280hrs | |
14 Layers | 144hrs | 292hrs | |
16-20 Layers | Depends on the specific requirements | ||
Above 20 Layers | Depends on the specific requirements |
Factory
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2 Oz High Density HDI PCB Board Programming Via In Pad Images |